High flow heat exchanger with a maximum flow rate of N2, 300 SLM.


  • Maximum flow rate 300SLM
  • Maximum operating temperature 250°C

Example of use

Dryer in semiconductor manufacturing process

The HX-0300C can heat high flow rates of gas up to 300SLM. Wafer drying with a high flow rate of heated gas leads to improved manufacturing throughput. In addition, since the heater part is not exposed to gas, it is ideal for use in semiconductor manufacturing and FPD manufacturing processes that require a clean environment.

Specification sheet

Flow rate (N2 conversion)Pressure lossWithstand pressure(G)Max. temperaturegas supply section

*Please contact us directly for detailed specifications of high flow rate heat exchanger.